Download A Guide to Lead-free Solders: Physical Metallurgy and by John W. Evans PhD (auth.), Werner Engelmaier Dipl.-Ing. PDF

By John W. Evans PhD (auth.), Werner Engelmaier Dipl.-Ing. (eds.)

While tin/lead solders have ruled the electronics for a few years, environmental issues and new laws are forcing switch. sponsored by way of greater than ten years of study in Pb-free solders, many electronics brands are poised for conversion.

A consultant to Lead-free Solders is meant as a device to assist because it strikes right into a new period within the creation and use of solders. an outline of the rules of soldering expertise is equipped starting with the idea underlying each one notion. concentrating on the main updated equipment for trying out and characterization, those theories are then bolstered through experimental examples and commercial applications.

• Addresses key concerns in meeting from a fabrics element of view.

• supplies the reader handy entry to information crucial for the right kind assessment and employment of state of the art ternary Sn/Ag/X solders

• permits comparability of the functionality of Pb-free solders with that of ordinary eutectic SnPb.

Although essentially of curiosity to expert layout and reliability engineers operating in electronics meeting and production, A consultant to Lead-free Solders can also be invaluable for graduate scholars trying to follow services in fabrics, mechanical or digital engineering during this undefined. Researchers in electronics and fabrics will locate the newest examine at their fingertips including the most probably instructions will want from such learn within the future.

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Additional resources for A Guide to Lead-free Solders: Physical Metallurgy and Reliability

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Higher metal loads make screening more difficult because higher squeegee pressures are required. However, higher metal loads tend to reduce slumping or flowout when the solder paste is heated, so that the incidence of bridging or electrical shorting may be reduced. 44 2 Packaging Architecture and Assembly Technology Several different rotational viscometers are available to assess the rheological behavior of solder pastes. A Brookfield-type viscometer equipped with a spindle and a helical path stand is most often used, but cone-and-plate-type Ferranti– Shirely viscometers have also been used (Jackson et al.

Pseudoplasticity implies that paste viscosity drops dramatically on the application of shear stress and recovers on removal of the stress. This is desirable behavior since it facilitates passage of the paste through the application screen or dispensing syringe while allowing it to remain on the desired area after the application stresses are removed. Finally, thicker pastes may also exhibit yield-point behavior, implying that a minimum shear stress is required to cause the paste to flow. Rheology is very important in applying the paste by stencil.

2002). Hence, Pb-free solders require surface-mount processes to be reoptimized in order to maintain low defect content. 2 Stenciling Stencil printing is widely used to transfer solder paste onto boards or to create balls for area-array packages. The stencil is held at a small distance (“snap-off”) from the board being printed; the downwards pressure of the squeeze overcomes the snap-off and creates a line contact between stencil and board that traverses the board due to the elasticity of the stencil.

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